特(te)別提示:下文涉及的題材或(huo)公司,內容(rong)羅列(lie)和(he)篇幅(fu)長短,與后續漲跌無關,亦均非(fei)進行推薦,僅作研究輔助。投資者應(ying)自(zi)主決策,注(zhu)意風(feng)險。 一、市場熱點 CoWoP:NV將在(zai)(zai)rubin ultra上考(kao)(kao)慮新方(fang)案 ◇驅(qu)動:2025年7月(yue)28日盤中(zhong)網(wang)傳(未證實),NV將在(zai)(zai)rubin ultra上考(kao)(kao)慮新方(fang)案,使(shi)用cowop工藝,將芯(xin)片(pian)直接封(feng)裝在(zai)(zai)PCB上。新方(fang)案將在(zai)(zai)oam上下增加載板(ban)(ban)(ban)(或(huo)玻璃基(ji)板(ban)(ban)(ban)、陶瓷基(ji)板(ban)(ban)(ban)),oam從HDI升(sheng)級(ji)到msap工藝。新方(fang)案相(xiang)當于(yu)pcb和(he)載板(ban)(ban)(ban)二合(he)一,會把單獨的載板(ban)(ban)(ban)替掉。載板(ban)(ban)(ban)、玻璃基(ji)板(ban)(ban)(ban)、陶瓷基(ji)板(ban)(ban)(ban)